Custom PCB Design For Data Centers

Datacenter JDM Product – Custom Data Center PCB Design

Custom PCB Design Challenge: To design a data center PCB that will be used as a data center product with a capacity of up to 60 M ASIC gates.

 

PCB Design Structure and Stackup

  • 24 Layer PCB
  • PCB size is 14.5×16 Inches and 110 mil thick
  • Printed Circuit Board material is Isola 370 HR
  • Layer stackup is 10 internal signal layers with mix dual and single strip line.
  • 8 GND layers and 4 PWR layers with 2oz copper
  • Standard PTH via technology used with FHS of 10 and 12 mils
Category:

Custom PCB Design for Data Centers:

PCB Design Features

  • 4 “Intel® Stratix® 10 GX 10M FPGA (1SG10M)”
  • Ethernet modules
  • USB connector
  • CPLD
  • 25 MHz CLK Generator
  • 100 MHz Ref CLK
  • 12V power external

ASIC/BGA Complexity

  • BGA has 4938 pins with 1mm pin pitch
  • Capacity Up to 60 M ASIC gates
  • FPGA consist of 2 separate Die. Each Die can support 2 Cores or 1 Core
  • Standard I/O speed: up to 1.4 Gbps
  • Transceiver Tiles: up to 17.4 Gbps

 

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