Electronics IC Package Design Services

Enhancement/Advancement in Technology is leading towards miniaturization of Electronic devices. Adding more function in small device is driving the move to multiple
circuits in smaller chip. IC packaging is the solution for that.

An IC (Integrated circuit) or a microchip is a combination of electronic circuitries on a small semiconductor (Silicon) flat piece. All the components of circuits are printed as a unit by photolithography. Usually a lot of MOSFET transistors, resistors, capacitors and
diodes integrate into a small chip. Advanced technology microchip may have billions of MOSFET transistors which will fabricate into a human fingernail size.

IC packaging is very important electronic component nowadays because of so many advantages (like compact in size, faster, reliable, cost effective, consumes less power and quick switcher) as compare with the discrete circuits. Last production stage of
semiconductor devices is packaging of semiconductor.

IC packaging makes semiconductor to stay protected from possible stress and make electrical connection from semiconductor chip to PCB.

WHIZZ systems provides a platform to their customers to offer complete and advance technology for IC packages and systems-in-packages (SiPs) designing. We provide services in different techniques of Package Designing like:

  1. Wire Bonding
  2. Flip chip

We also have expertise in Chip-on-Board (COB) PCB designs. Signal and power integrity analysis ensures that electrical and physical challenges can be jointly
addressed throughout the design cycle.

Functional density and heterogeneous IC packaging meets the needs of different industries like:

  • Artificial intelligence (AI)
  • High-performance computing (HPC)
  • Aerospace
  • Medical
  • IoT
  • Mobile Computing
  • Automotive
  • 5G
  • Virtual reality (VR)
  • Augmented reality (AR)