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PACKAGE DESIGN & SIMULATION
Our team analyzes each design before manufacturing by running the designs through various simulations to ensure each product is capable of meeting the specified requirements and expectations.
Functional density and heterogeneous IC packaging meets the needs of different industries like:
- Artificial intelligence (AI)
- High-performance computing (HPC)
- Aerospace
- Medical
- IoT
- Mobile Computing
- Automotive
- 5G
- Virtual reality (VR)
- Augmented reality (AR)
We provide a platform to our customers to offer complete and advance technology for IC packages and systems-in-packages (SiPs) designing.
We provide services in different techniques of Package Designing like:
- Wire Bonding
- Flip chip
We also have expertise in Chip-on-Board (COB) PCB designs. Signal and power integrity analysis ensures that electrical and physical challenges can be jointly addressed throughout the design cycle.
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