Managing High-Power Demands in Next-Generation Hardware

Key Challenges in High-Density Systems

Why Traditional Designs Can’t Keep Up

The increased power demands of AI accelerators introduce multiple complex challenges in design and manufacturing, especially when dealing with high-current needs. Traditional power distribution methods, initially designed for more modest currents, fall short in providing the stability required for systems operating above 1,500 amps. Managing high-power requirements in such scenarios demands careful consideration of power delivery networks (PDNs), which must ensure consistent voltage levels, prevent excessive IR drops, and minimize power losses.

Signal Integrity at Risk

One of the primary hurdles in designing high-power systems is IR drop management. As current flows increase, the voltage drop across power paths becomes more pronounced. These IR drops reduce the voltage at critical points on the board, affecting component stability and performance.

Maintaining minimal IR drop is essential for systems where even minor fluctuations in power delivery can compromise operation

Thermal Management Challenges

Furthermore, thermal management is a considerable challenge. High-current systems generate significant amounts of heat, especially when components are densely packed to reduce board size.

Without proper heat dissipation, components can reach temperatures that lead to reduced efficiency, compromised lifespan, or outright failure. The challenge of thermal management requires advanced cooling solutions that can disperse heat effectively across all areas of the board, including high-density sections.

Need for Energy Efficiency and Standards Compliance

In this evolving landscape, it is crucial for designs to meet industry standards and provide energy-efficient solutions that balance performance with power management.

Whizz Systems’ expertise in designing for high-power demands allows us to meet these requirements, ensuring our designs are both high-performing and compliant.

Whizz Systems’ Approach and Expertise

How We Design for Extreme Power Performance

Whizz Systems specializes in meeting the high-power demands of next-generation AI hardware through comprehensive power delivery solutions. Our approach focuses on three core areas: efficient power distribution, thermal management, and regulatory compliance, ensuring reliable and energy-efficient designs.

Optimized Power Distribution Networks (PDNs)

We use advanced power distribution networks (PDNs) tailored to support the intense power requirements of AI accelerators.

Through optimized PDN topologies, we:

• Minimize IR drops
• Ensure consistent, stable power delivery across the board

Our layouts carefully consider:

• Trace widths
• Via placements
• Power distribution planes

All designed to reduce resistance and maintain voltage integrity across the board. This meticulous attention to power flow helps prevent common issues associated with high-current designs, such as unstable operation or component failures.

Advanced Thermal Management

Thermal management is a crucial aspect of high-power system design.

Our team incorporates advanced cooling solutions including:

• Heat sinks
• Thermal vias
• Vapor chambers
• Liquid cooling systems

These solutions dissipate heat effectively, ensuring stable operation even under demanding loads. They are carefully tailored to the specific requirements of each design, accommodating the unique thermal profile of high-power components and providing optimal heat dissipation.

Regulatory Compliance

Our experience with industry standards allows us to design high-power solutions that comply with regulatory requirements, ensuring that our products meet the necessary guidelines for safety and efficiency.

By aligning our designs with these standards, we deliver reliable solutions that our clients can seamlessly integrate into their AI hardware platforms.

Key Considerations for Customers

What to Prioritize in High-Power Hardware Development

When developing hardware with high-power requirements, companies must address several crucial factors to achieve optimal performance and reliability.

• Ensure a robust power delivery network (PDN) design to minimize voltage drops and maintain stable power across the system.
• Design for efficiency to minimize power loss and maximize performance.
• Ensure system scalability to accommodate growing power demands over time.
• Incorporate fail-safe mechanisms for power regulation and temperature control to enhance reliability.
• Utilize advanced thermal management techniques like liquid cooling, thermal vias, and vapor chambers to manage heat in high-power designs.
• Choose materials with superior thermal conductivity and implement effective heat dissipation strategies to improve component lifespan and reduce thermal stress.
• Assess and test power systems under real-world conditions to identify potential vulnerabilities.
• Focus on minimizing electromagnetic interference (EMI) and ensuring electromagnetic compatibility (EMC).
• Consider environmental factors such as humidity and temperature variations for more resilient hardware solutions.
• Adhere to industry standards for safety, performance, and compatibility to ensure system integration with other platforms.
• Collaborate with experts skilled in optimizing layout, component selection, and managing high-current systems to reduce power losses and prevent instability due to voltage fluctuations.

Real-World Success Example

An example of Whizz Systems’ expertise is demonstrated in our recent project involving a custom Open Compute Project (OCP) Accelerator Module, designed to handle extreme performance workloads. This advanced module required an impressive 1600A of current and over 2000W of power to drive its AI acceleration capabilities at peak efficiency. To meet these demanding specifications, we implemented a carefully engineered power delivery network (PDN) strategy, coupled with advanced cooling solutions, ensuring stable thermal performance even under sustained full-load operation. Our innovative approach maintained a consistent operating temperature, safeguarded signal integrity, and enabled the module to deliver reliable, high-throughput processing in one of the most power-intensive designs we’ve ever realized. 

Our deep familiarity with industry standards, including OCP guidelines, enabled us to develop a high-power solution that not only met but exceeded regulatory safety and efficiency requirements. By aligning our design approach with these stringent standards, we delivered a robust, standards-compliant solution that clients can confidently integrate into their next-generation AI hardware platforms.