Integrated Manufacturing Services for Complex Products
At Whizz Systems, advanced manufacturing goes far beyond traditional build-to-print assembly. We integrate engineering, supply chain, process control, and real-time validation into one seamless workflow—helping customers bring complex electronic products to market faster and with higher quality. From component procurement to prototype validation and ongoing production, we deliver complete ownership of your manufacturing pipeline.
Process Engineering
Why Our Manufacturing Yield Is So High?
Our Process Engineering team works hand-in-hand with design engineering to optimize each build before it hits the line. This synergy allows us to fine-tune solder chemistry, thermal profiles, and layout variables for each product type—whether it's a tiny module or a dense, copper-heavy board.
Custom Fixtures and Stencils
To boost yield from the first proto run, we create custom fixtures that support press-fit, POP, through-hole, and mixed-assembly components—even for high-layer-count boards or designs using 8–10 oz copper planes. We also design our stencils in order to optimize solder paste usage and reduce error for excess solder paste.
Solder Paste Optimization
We calibrate the solder chemistry, thermal oven profiles, and dispense volumes for each board. Our knowledge is based on 25+ years of building some of the industry’s most complex products—both client-designed and internally developed.
Thermal Profiling & Build Plan Validation
Whether your board has tight form factors or heavy copper planes, our thermal profiles are customized for heat distribution and solder integrity. We validate every prototype 100%, so issues are caught before volume runs begin.
Manufacturing Testing & Quality Assurance
Ensuring First-Time Success, Every Time
At Whizz Systems, we take quality seriously—even during the first few prototypes. Our high-yield results are a direct outcome of a meticulous and layered manufacturing testing process, starting from the moment the kit is loaded onto the production floor. With multiple layers of inspection—manual, automated, and imaging-based—Whizz Systems ensures the highest quality for every build, from prototype to production. This rigorous, process-driven approach is why customers trust us with their most complex electronic assemblies.
With multiple layers of inspection—manual, automated, and imaging-based—Whizz Systems ensures the highest quality for every build, from prototype to production. This rigorous, process-driven approach is why customers trust us with their most complex electronic assemblies.
Kit Validation & First Article Build
Before a single component is placed, our team validates the entire kit against the build documentation and CAD files. We confirm that every part is present, correctly specified, and ready for accurate placement. Once validated, we begin with a First Article build—a time-intensive process where a single board is built and thoroughly inspected before proceeding to the rest of the batch.
Solder Paste Inspection (SPI)
Before components are even placed, our SPI process verifies the volume, alignment, and shape of solder paste deposits to prevent cold joints or bridging errors downstream.
First Article Inspection
Once the First Article is complete, it undergoes a manual inspection by our QC team using detailed board documentation and assembly drawings. Every component is verified for:
- Correct value
- Proper location
- Accurate orientation (to prevent polarity errors or misalignment)
Mechanical Operations with Precision Control
For assemblies that require mechanical integration—such as brackets, custom mounts, or sockets—we predefine the correct torque values and installation steps. These second ops are executed with the same precision as our SMT processes.
Automated Optical Inspection (AOI)
After pick-and-place and oven reflow, boards pass through our upgraded, world-class AOI machines. These machines analyze the entire assembly to verify:
- Correct component placement
- Solder joint integrity
- Misalignments or missing parts
- 3D inspection of component
X-Ray Inspection for Deep Verification
The final layer of quality control is X-ray inspection using our state-of-the-art machines. This allows us to: Inspect solder joints under BGAs and other hidden components Detect shorts or opens between vias and pads Analyze solder voids and joint integrity across multiple layers 3D images of solder joints
Global Manufacturing | Whizz Systems' Strategic Advantage
Bridging NPI Agility with Scalable Production
At Whizz Systems, we offer a truly global manufacturing model designed to support your product from early prototyping to full-scale production. Our manufacturing footprint includes a high-mix, low-volume NPI facility in Silicon Valley and a high-speed, cost-efficient production plant in Malaysia.
Fast Turns and NPI Agility
USA Facility
Located in the heart of Silicon Valley, our facility is optimized for quick-turn NPI and pilot builds.
High equipment availability by design: Low utilization ensures capacity for urgent programs.
Built for responsiveness: We run one shift with the option to expand to a second.
Ideal for early-stage startups and programs needing U.S.-based production for IP or compliance.
High-Volume, High-Quality Production
Malaysia Facility
Established in 2008, our Malaysia facility is wholly owned and operated by Whizz Systems.
80,000 sq. ft. state-of-the-art plant
Equipped with high-speed Fuji lines for production-grade builds
Room for growth: physical space and staffing flexibility with only one shift currently active
Seamless internal transfer from our U.S. site with full engineering support—no burden on customers
Environmental Testing | Stress-Tested for Real-World Reliability
Ensure your hardware meets performance standards—even in the toughest conditions
At Whizz Systems, our commitment to quality doesn’t end at manufacturing. Once prototype boards are built and functionally debugged, we offer comprehensive environmental testing services to validate long-term durability and performance under extreme operating conditions. These tests are essential for customers who must meet internal quality standards or deliver verified data to their end users, particularly in industries like semiconductors, AI, and data centers.
Temperature Cycling & Burn-In Testing
We begin by running temperature cycling programs in-house using our state-of-the-art environmental chambers. Boards are subjected to cycles of extreme high and low temperatures to evaluate performance degradation, determine failure points, and ensure continued functionality under fluctuating thermal conditions. Burn-in testing is also offered to simulate prolonged operation, often up to 24 hours or longer, as requested by the customer. These cycles help verify whether a design can sustain its electrical and mechanical performance under stress.
Vibration & Shock Testing
For vibration and shock testing, we partner with certified independent labs that specialize in MIL-STD and industrial-grade standards. Boards are tested under mechanical stress to replicate conditions such as shipping, installation, or use in rugged environments. This phase helps identify weaknesses in component mounting, solder joints, and board structure to ensure resilience and mechanical reliability.
Drop Testing
Drop testing is performed to determine the impact threshold of the product when subjected to sudden mechanical shocks. Boards are dropped from specified heights to simulate real-world handling scenarios, such as shipping accidents or field mishandling. The results help assess structural integrity and verify whether enclosures and assemblies can withstand these events without failure.
Sampling Protocols for Production
In full production, customers often require sampling protocols to validate ongoing reliability. For instance, data center customers may specify a 24- or 72-hour burn-in period for one in every ten boards out of a 1,000-unit batch. We accommodate these needs with the infrastructure to run extended environmental tests in parallel with ongoing manufacturing.
Fix Spacing | Shipping Smarter, Safer, and On-Brand
Tailored Packaging Based on Product & Logistics Needs
We start by analyzing key details: the size and fragility of the board, whether accessories or additional materials are included, and how many units will be shipped per package. Whether boards are sent individually or in bulk, we design packaging that mitigates damage risk during transit and handling.
Material Selection
We use the right grade of foam, custom inserts, and protective layers to avoid damage and static discharge.
Kit Consolidation
Every component, accessory, and marketing material is accounted for in a detailed kit supply list.
Brand & Presentation
For customer-facing deliveries, we also integrate marketing and presentation materials as required.
Logistics Optimization
We design for both internal distribution and final shipment from our facilities to customer or end-user destinations.
Upfront Planning, Zero Surprises
Packaging is often overlooked, especially in early-stage startups. At Whizz Systems, we integrate packaging design into the initial planning process to eliminate surprises. This ensures readiness by the time the product is finalized, enabling a seamless transition from production to delivery without delays or packaging-related risks.
Box Build & Mechanical Assembly | From PCB To Full System Assemly
High-Precision Mechanical Assembly at Whizz Systems
At Whizz Systems, we extend our manufacturing services beyond PCB assembly to deliver fully integrated systems through our in-house box build capabilities. Whether it’s assembling components into a compact enclosure or populating a full server chassis, our team handles mechanical integration with the same level of rigor as our electronic manufacturing processes.
We support a range of enclosure solutions—from customer-supplied mechanical designs to fully engineered enclosures developed in collaboration with our team. Our box build services cover:
Board-level mechanical builds.
Multi-board integration into chassis or server racks.
System-level assembly with thermal, structural, and cable management in mind.
Capabilities & Tooling
- Precision Assembly Tools: We use automated and calibrated tools to maintain high mechanical build accuracy and repeatability.
- Material Flexibility: Our team works with aluminum, plastics, metals, and even custom materials like wood where needed.
- Cable Management: We manufacture custom cables in-house and partner with trusted suppliers for complex assemblies. We manage routing, strain relief, and airflow optimization within each build.
- Cooling Solutions Integration: Our mechanical team ensures that cooling systems—fans, heat sinks, airflow ducts—are properly mounted and optimized for system reliability.