NextGen Hardware Design for High-Density, High-Complexity Systems

Key Challenges in High-Density Systems

Pin Count and Design Complexity

In AI hardware, complexity extends beyond merely connecting components. The continuous increase in the number of pins in the new generation of chips raises serious issues in design and fabrication.

For example, chips with 5,500 pins, just to name a few aspects of the design process, require extreme attention to detail in:

• Pin configuration,
• Signal routing, and
• Thermal management

Signal Integrity at Risk

One of the main issues is maintaining good signal integrity with all of the components so close together on  high density boards. 

With more connections packed into a limited space, the risk of signal crosstalk increases, potentially leading to:

• Data corruption
• Reduced System Performance.

Companies have to use really sophisticated methods to overcome these problems, like:

• Impedance-controlled routing
• Precisely optimized layouts.

Power Distribution Challenge

Power distribution becomes a major issue because higher pin counts seem to also mean higher power requirements. The power must be distributed evenly, because if not, then "thermal hotspots" will occur, which can cause system instability, or even failure. With increasing complexity in designs, the requirement for efficient thermal management solutions becomes even more paramount in order to maintain the life and reliability of high performance systems.

Whizz Systems’ Approach and Expertise

Turning Complexity into Competitive Advantage

Whizz Systems is dedicated to mastering the challenges of advanced hardware complexity, particularly when it comes to managing high-pin count chips or high-density boards.  Our approach involves a comprehensive understanding of the critical electrical and mechanical constraints that impact high-performance systems. By leveraging advanced design methodologies, we address the intricacies of complex hardware—including signal integrity, power distribution, and thermal management—ensuring efficient, reliable solutions

Optimized Ball Mapping and Layout Strategy

Our team specializes in creating optimized ball maps and pin configurations tailored for high-pin count chips.

Through the use of advanced design tools and techniques, we:

• Reduce the risk of signal crosstalk
• Enable reliable data transmission.

For instance, we focus on reducing trace lengths and optimizing layout to prevent data loss and maintain signal fidelity. 

Robust Power Delivery Across High-Density Boards

This meticulous planning extends to power distribution, where we implement strategies to ensure:

• Efficient power delivery across densely populated boards
• Mitigating the risk of thermal issues

Proper power planning supports stable performance,especially as boards continue to grow more complex and demanding.

Advanced Thermal Management Solutions

Speaking of thermal management, we know one of the major problems is going to be the amount of heat generated by all the components packed into a small space.

Whizz Systems employs advanced cooling solutions, such as vapor chambers and liquid cooling systems, to achieve superior thermal dissipation.

These cooling technologies allow high performance AI systems to:

• Efficient power delivery across densely populated boards
• Mitigating the risk of thermal issues

Best Practices in Action

For instance, in a recent project involving a high density board with a high pin count ASIC, Whizz applied best known methods of layout design and power management. Our innovative topologies allowed for seamless integration of the chip into the application solution, enabling maximum performance even under extreme conditions. Our extensive experience with industry standards, equips us to deliver solutions that meet rigorous performance and reliability criteria. Whizz Systems is committed to providing tailored solutions, whether adhering to established industry frameworks or creating proprietary designs for specialized applications. We combine years of experience with the latest in technical innovation to make sure every product satisfies the needs of today's AI systems and high density hardware.