May 29, 2024
Heatsink
Thermal Management
Building the Future of 5G Connectivity with Open Radio Unit Solutions
In collaboration with Intel, Analog Devices, Comcores, and Radisys, Whizz Systems has developed a groundbreaking 5G Open Radio Unit (ORU) white box solution. This white paper delves into our comprehensive design, engineering, and manufacturing process, showcasing how our integrated expertise in hardware, thermal, mechanical, and power engineering drives the development of next-generation cost-effective, high-performance 5G solutions.
Introduction to 5G ORU
Meeting the Demand for Cost-Effective 5G Radio Units
Overcoming Range Limitations with Advanced 5G ORU Solutions
5G radio networks provide increased bandwidth at the expense of reduced range. To address this, cost-effective radio units are critical for expanding coverage. Whizz Systems, in collaboration with Intel, Analog Devices, Comcores, and Radisys, developed the 5G Open Radio Unit (ORU) white box solution to meet this growing market need.
This white paper provides an overview of the design and development process for the hardware components that make up the 5G ORU white box. Whizz Systems is responsible for the electrical, thermal, mechanical engineering, and manufacturing aspects, as well as system validation and bring-up of the turnkey white box ORU solution.
Our Expertise in 5G ORU Design and Engineering
Whizz Systems: End-to-End Expertise in 5G ORU Development
Whizz Systems is responsible for the electrical, thermal, mechanical engineering, and manufacturing of the ORU white box. Our expertise spans the design of individual PCBAs, system validation, and thermal simulation for optimized heat dissipation.
By leveraging Intel’s Arria 10 FPGA as a reference, we revamped the power and clocking schemes and added a JESD interface for communication between the Intel Arria 10 FPGA and Analog Devices’ ADRV902X chip. This was further enhanced with a board-to-board (BTB) header for interfacing with either the ADI-designed RFFE Card or the Whizz-designed ORU Adapter Card.
Key Features and Specifications
Next-Gen 5G Features to Drive the Future of Connectivity
The ORU white box is designed for high-performance with 4T4R TDD communication and a tunable frequency range from 600MHz to 6GHz with a 100MHz signal bandwidth. Featuring Intel’s Arria 10 SX processor, the ORU includes:
1GB DDR4 HPS Memory • 2GB DDR4 FPGA Memory • QSFP ports (40Gbps transfer rate) • USB to UART interface • Ethernet with 1PPS/10MHz clock for synchronization
Overcoming Design Challenges
Addressing Complex Design Challenges with Precision Engineering
Solving Signal Integrity, Power, and Thermal Management Issues
Designing the ORU required overcoming several key challenges:
Signal Integrity & Power Design: Our SI/PI simulations optimized high-speed signal routing and minimized IR drops for power delivery.
Thermal Management: Through thermal simulations, we guided the selection of heat sinks and optimal airflow configurations in the mechanical enclosure.
RF Signal Isolation: A GND shield around the ADI chip isolates RF signals to minimize interference.
Mechanical Enclosure Design
Meeting the Demand for Cost-Effective 5G Radio Units
Aluminum Alloy Enclosure with Custom Cooling Solutions
The ORU white box is housed in an aluminum alloy enclosure, providing a lightweight and durable solution with optimized airflow for cooling. We prioritized off-the-shelf hardware to reduce cost, using ABS plastic end caps for added durability and shock absorption. The chassis design was revised for both aesthetic appeal and cost-effectiveness.
Thermal Management and Solutions
Ensuring Optimal Heat Dissipation in Every Configuration
We employed thermal simulations for both the ORU and RFFE cards to ensure efficient heat dissipation. The simulations validated that critical components operated within thermal limits, and the selected heat sinks and fans provided optimal airflow with minimal pressure noise.
Roadmap and Future Developments
The Future of 5G with Whizz Systems' ORU Solutions
Available Now for Testing, with More Derivatives Coming Soon
The ORU white box solution is available for testing, with general availability expected in Q4 2020 or early 2021. Future derivatives, including 2T2R, 8T8R, and lower-power versions, are also being explored to meet different customer needs
